G. Altena et al. (Holst Centre IMEC-NL, IMEC vzw)
Electrostatic energy scavengers for wireless autonomous transducer solutions (PDF, 127 KB)

V.M. Blanco Carballo et al. (University of Twente, MESA+, NIKHEF)
An integrated gaseous detector using microfabrication post-processing technology (PDF, 357 KB)

Y. Chen et al. (Delft University of Technology, Bath University)
Strain Amplifying Property of Bioinspired Membrane-in-Recess Microstructure: Analytical Modelling (PDF, 275 KB)

Y. Chen et al. (Delft University of Technology)
Preliminary study on the design of a silicon bio-inspired MEMS gyroscope (PDF, 314 KB)

P. Andricciola et al. (Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology)
Electrical Characterization of Silicon Nitride and Silicon Carbide CVD layers as passivation on High Resistivity Silicon Substrates (PDF, 577 KB)

A. Boogaard et al. (MESA+)
Characterization of High-Density Inductively-Coupled Remote Plasma System by Langmuir Probe and Optical-Emission Spectroscopy (PDF, 296 KB)

I. Brunets et al. (MESA+)
Memory Devices with Encapsulated Si Nano-Crystals: Realization and Characterization (PDF, 552 KB)

V. Gonda et al. (Delft University of Technology)
Degradation of diode junction characteristics due to residual defects caused by laser-annealed implantations studied by bipolar test structures (PDF, 111 KB)

G. Lorito et al. (ECTM-DIMES)
Analysis of the base-collector junction breakdown voltage in silicon-on-glass bipolar transistors (PDF, 284 KB)

G.T. Sasse et al. (MESA+)
Interface Trap Response to RF Charge Pumping Measurements (PDF, 222 KB)

L. Shi et al. (ECTM-DIMES)
JFET test structures for minitoring strain-enhanced mobility (PDF, 195 KB)

N. Stavinski et al. (MESA+, Philips, DIMES)
Cross-Bridge Kelvin Resistor (CBKR) Structures for Silicide-Semiconductor Junctions Characterization (PDF, 208 KB)

M.P.J. Tiggelman et al. (MESA+, Philips)
Electrical characterization of thin film ferroelectric capacitors (PDF, 204 KB)

M. Verbaan et al. (DIMES)
Fourier Transform Photocurrent Spectroscopy in Hydrogenated Amorphous Silicon (PDF, 233 KB)

B. Vet et al. (ECTM-DIMES)
Sensitivity study of model parameters for high-efficient amorphous silicon solar cells (PDF, 737 KB)

Y. Civale et al. (ECTM-DIMES, Kavli Institute of Nanoscience)
Process Control of Aluminum-Doped Silicon Deposited by Low-Temperature Material-Inversion Solid-Phase Epitaxy (PDF, 625 KB)

A. Domdey et al. (Hamburg University of Technology)
First principles study of the degradation of silicon-dioxide gatedielectrics (PDF, 254 KB)

G. Van Elzakker et al. (DIMES)
Layer-by-layer deposition of thin silicon films from hydrogen diluted silane (PDF, 287 KB)

L. La Spina et al. (ECTM-DIMES)
Electrical Characterization of PVD Aluminium Nitride Deposited on Silicon (PDF, 216 KB)

M. Popadic et al. (ECTM-DIMES)
Profile Engineering of Decreasing Arsenic Doping in Silicon RPCVD (PDF, 280 KB)

F. Sarubbi et al. (ECTM-DIMES)
Uniformity of CVD boron-silicide layers on silicon (PDF, 124 KB)

F. Wali et al. (University of Twente, University of Utrecht, Philips Semiconductors)
Detection and deposition of particles during Integraged circuits manufacturing (PDF, 710 KB)

M.A. Wank et al. (ECTM-DIMES, Eindhoven University of Technology)
Control of the ion-energy distribution and measurement of ion currents with a non-sinusoidal substrate bias (PDF, 183 KB)

J. Wei et al. (DIMES)
Two-level DRIE for 3D MEMS structures (PDF, 1.4 MB)

B. Yan et al. (ECTM-DIMEs)
Fabrication of Porous Anodic Aluminum Oxide Templates and Pattern Transfer (PDF, 1.1 MB)

T. Zoumpoulidis et al. (Delft University of Technology, HiTeC-DIMES)
Process technology for electronics on flexible and stretchable substrates (PDF, 2.2 MB)

J.L. van Hemmen et al. (Eindhoven University of Technology, Philips, Oxford Instruments Plasma Technology)
Remote plasma atomic layer deposition of Al2O3 (PDF, 620 KB).

J. Iannacci et al. (HiTeC DIMES, Universita di Bologna)
Electrical Performance Assessment and Optimization of an RF-MEMS Wafer-Level Package (PDF, 788 KB)

J. Jovanovic et al. (ECTM-DIMES, University of Zagreb)
Application of spacer hard0masks for sub-100 nm wide silicon fin-etching (PDF, 437 KB)

M. Saadaoui et al. (ECTM-DIMES)
Copper electroplating for 3D interconnects (PDF, 691 KB)

S. Sosin et al. (Delft University of Technology, HiTeC-DIMES)
Fabrication of Through-Substrate Cavities for Hybrid Wafer-Level Packaging (PDF, 699 KB)