Prof.dr. M. Vellekoop, Vienna University of Technology
Micro-devices for particle detection and analysis

A. Karilainen, Technical University of Hamburg-Harburg
Dry and Capacitive Electrodes for Long-Term ECG-Monitoring (PDF, 1.2 MB)

Prof. M. Moeller, Saarland University
Exploring the limits - Development of integrated high-speed circuits (PDF, 772.5 KB)

J.Tian, DIMES
Low temperature wafer-level packaging of RF MEMS using SU8 printing

Dr. E.H.M. Heijne, CERN
Gigasensors for atto objects

Dr. S. Kubicek, IMEC
Scaling of digital CMOS technology to 45nm node and below

M. Duemling, Technical University of Hamburg-Harburg
Encapsulation of a resonating structure using substrate transfer and thin film processes (PDF, 2.3 MB)

Prof. Ch. Boit, Berlin University
Failure analysis of deep micron devices

P.C.P. Bronsveld, Utrecht University
Development of Thin Film Silicon Solar Cells below 100°C on Flexible Low Cost Substrates (PDF, 671.8 KB)

P. Srinivasan, IMEC
Channel length and oxide thickness scaling effect on low frequency (1/f) noise in metal/high-k deep submicron MOSFETs (PDF, 636.7 KB)

P.C.P. Bronsveld et al. (Utrecht University)
Development of Thin Film Silicon Solar Cells below 100°C on Flexible Low Cost Substrates (PDF, 292.3 KB)

P. Srinivasan et al. (IMEC, KU Leuven)
Channel length and oxide thickness scaling effect on low frequency (1/f) noise in metal/high-k deep sub-micron MOSFETs (PDF, 252.2 KB)

M. Chefdeville et al. (NIKHEF, MESA+)
Integration of a gas gain grid on a pixel readout ASIC for high energy charged particle detection (PDF, 168.3 KB)

T. Chu Duc et al. (Delft University of Technology)
Piezoresistive Cantilever for Mechanical Force Sensors (PDF, 131.8 KB)

E.J. Connolly et al. (DIMES, MESA+)
An Ammonia Sensor based on a Porous SIC Membrane (PDF, 1MB)

A. Firouzian et al. (Delft University of Technology)
Planar sensor structures for whole blood viscosity measurements (PDF, 194.4 KB)

A. Karilainen et al. (Hamburg University of Technology)
Dry and Capacitive Electrodes for Long-Term ECG-Monitoring (PDF, 343.8 KB)

G. Pandraud et al. (Delft University of Technology)
Low temperature LPCVD SiN direct bonding for sensors (PDF, 355.7 KB)

S. Sosin et al. (Delft University of Technology, IMT Bucharest)
A Calorimetric Micro-Sensor for Methane Detection (PDF, 170.8 KB)

W.J. Venstra et al. (Delft University of Technology, DIMES)
Microcantilevers inside Nanoliter Wells (PDF, 366.9 KB)

L. Wang et al. (Delft University of Technology, DIMES)
Mechanical Reliability of Ultra-Thin Silicon Substrates Under Bending and Tensile Loads (PDF, 285.1 KB)

C.K. Yang et al. (Delft University of Technology, Kavli Institute)
Field-Emission Nano-tip for Microresonator Detections (PDF, 467 KB)

L. Zhang et al. (Delft University of Technology)
Particle Separation by Dielectrophoresis (PDF, 669.1 KB)

G. van Elsakker et al. (DIMES)
Characterization of Defects in Thin-Film Silicon (PDF, 2.2 MB)

E.J. Faber et al. (MESA+, Wageningen University)
Electrical behavior of mercury- organic monolayer-silicon devices: effect of substrate orientation and molecule type (PDF, 312 KB)

R.W. Herfst et al. (Philips, MESA+)
Characterization of dielectric charging in RF MEMS. (PDF, 319 KB)

C.Huang et al. (DIMES)
Low Phase Noise LC Oscillators (PDF, 446.1 KB)

A. Kautaniuk et al. (DIMES)
Verification of Mextram 504.6 in Verilog-A and C-code et al. (SiMKit 2.1.1) implementation (PDF, 210.3 KB)

A. Klaver et al. (DIMES-ECTM)
Considerations in the Development of a Model to Predict EOL Efficienty of Amorphous Silicon Solar Cells for Space Applications (PDF, 118 KB)

G. Lorito et al. (DIMES-ECTM)
Analytical modeling and numerical simulations of the offset voltage in silicon-on-glass vertical PNPs (PDF, 271.6 KB)

B.E. Pieters et al. (DIMES)
Extraction of the defect density of states of a-Si:H using Q-DLTS (PDF, 132 KB)

H. Sagkol et al. (DIMES)
High Aspect Ratio Copper Electroplating Process for Compact Coplanar Transmission Line Implementation (PDF, 223.5 KB)

G.T. Sasse et al. (MESA+)
The RF charge pump technique for measuring the interface state density on leaky dielectrics (PDF, 118.9 KB)

N. Stavitski et al. (MESA+, Philips Leuven, Philips Research)
Specific Contact Resistance Measurements of Metal-Semiconductor Junctions (PDF, 132.8 KB)

J. Tian et al. (DIMES)
Low Temperature Wafer-Level Packaging of RF MEMS using SU8 Printing (PDF, 354.6 KB)

J.M. Tomasik et al. (Hamburg University of Technology)
A Model for Switched Biasing MOSFET 1/f Noise Reduction (PDF, 285.9 KB)

H. Yan et al. (DIMES)
Integrated Scheme for RF Power Harvesting Applications (PDF, 409.4 KB)

A.A.I. Aarnink et al. (University of Twente)
A high-density Inductively-Coupled Remote Plasma System for the deposition of dielectrics and semiconductors (PDF, 63.6 KB).

R.G. Bankras et al. (MESA+)
In-situ RHEED Analysis of Atomic Layer Deposition (PDF, 389.6 KB)

I. Brunets et al. (MESA+)
Three-Dimensional IC’s prolong the life of Moore’s Law (PDF, 319.3 KB)

Y. Civale et al. (ECTM-DIMES, Kavli Institute)
Fabrication and numerical analysis of nanoscale silicon pillars for IC applications (PDF, 653.1 KB)

M. Duemling et al. (Hamburg University of Technology, Philips Research, Philips Semiconductors Hamburg)
Encapsulation of a resonating structure using substrate transfer and thin film processes (PDF, 448.5 KB)

V. Gonda et al. (DIMES-ECTM)
The effect of the contact window edges on the perimeter currents of shallow junction diodes (PDF, 97.7 KB)

S.B.S. Heil et al. (TUE, Philips, Delft University of Technology)
Low Temperature Deposition of TiN by Plasma-Assisted Atomic Layer Deposition for System-in-Package Applications (PDF, 335.8 KB)

S. Hoang Le et al. (Delft University of Technology, Vietnamese Academy of Science and Technology)
Anodic Aluminium Oxide Templates for Nanocapacitor Array Fabrication (PDF, 463.8 KB)

P. Khalili et al. (DIMES)
Band structures of coupled surface magnetostatic waves in magnetic multilayers (PDF, 1.4 MB)

R. Komaragiri et al. (Darmstadt University of Technology)
Depletion-Free Poly Gate Electrode Architecture for Sub 100 Nanometer CMOS Devices with High-K Gate Dielectrics (PDF, 239.5 KB)

L. La Spina et al. (DIMES-ECTM)
PVD Aluminium Nitride as Heat-Spreader in IC Technology (PDF, 202.9 KB)

P. LeMinh et al. (MESA+)
The Effect of an Electric Field on a Lateral Silicon Light-Emitting Diode (PDF, 223.8 KB)

H.W. van Zeijl et al. (DIMES, ASML)
Waferstepper alignment offset compensation for MEMS and substrate transfer processes (PDF, 611.3 KB)