Integrated micro-fluidic cooling in laminated flexible micro-systems (11734)

Electronic devices will in the future be made more and more also as flexible system-in-foil (SIF) which can contain ultra-thin (15 - 50 micron) flexible embedded silicon chips. A challenge is given by the low thermal conductivity of the very thin polymeric package aggravating the heat management problem. This problem could potentially be addressed by embedding micro-channels containing a flowing cooling medium in the polymer foil in close proximity and preferably directly underneath the electronic circuit.

Our goal is to evaluate, numerically and experimentally, two promising techniques for local thermal control: a self-provoking and a magnetically-driven micro-flow. Also the manufacturing of these systems will be studied in this project: laser ablation and re-deposition suppression for fabrication of optically transparent, sealed and integrated micro-channels will be investigated.