Schade in soldeerverbindingen veroorzaakt door thermomechanische belasting (EWT.4924)

Scientific summary

This research project focus on the numerical-experimental analysis of the reliability of solder alloys used in micro-electronics. The research work focuses on microstructure evolution, viscoplastic damage, interfacial failure and the intrinsic thermal and mechanical anisotropy of these materials. Thermo-mechanical analyses are carried out on the reference Sn-Pb solder and on Pb-free solders, where a range of length scales are scrutinized through coupled modelling and experimentation.

Short utilization summary

The utilisation of this project mainly focuses on the direct availability of decisive information for the use of the next generation of solder joints made of a Pb-free solder, in close comparison to the reference Sn-Pb solder, in order to (1) assess their impact on new soldering technologies; (2) assess the influence of processing conditions on manufactured Pb-free solder joints; (3) assess the lifetime of micro-electronics components based on the thermomechanical fatigue failure of the joints.

Zie de website van de vakgroep.

Philips CFT, TNO-Industrie en Thales Nederland BV zijn bij dit project betrokken.

Prof.dr.ir. M.G.D. Geers
Technische Universiteit Eindhoven
Werktuigbouwkunde
Postbus 513
5600 MB Eindhoven